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3 research outputs found
A new under bump metallurgy for solder bump flip chip applications
Author
Heitmann R.
Heitmann R.
+4 more
Jorma Kivilahti
Kari Kulojärvi
Kivilahti J.K.
Kulojärvi K.
Publication venue
'Emerald'
Publication date
Field of study
No full text
Crossref
Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints
Author
A. Ganguluee
A. Zribi
+17 more
A. Zribi
A.M. Minor
A.M. Minor
C. E. Ho
C. R. Kao
C.E. Ho
C.E. Ho
C.E. Ho
H. Nowotny
J.H. Lee
K. Kulojärvi
K.N. Tu
L. C. Shiau
M. Yousuf
R. Kubiak
S. Furuseth
Z. Mei
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints
Author
C. R. Kao
CC Li
+19 more
CC Li
CE Ho
CM Chen
H. Y. Yu
HK Cheng
HK Cheng
HPR Frederikse
HW Yang
HY Chuang
HY Chuang
JJ Yu
K Kulojärvi
ME Glicksman
T. H. Yang
WM Chen
WM Haynes
Y Kaganovskii
Y. W. Wang
YS Kaganovskii
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref